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portada Through Silicon Vias: Materials, Models, Design, and Performance
Type
Physical Book
Author
Publisher
Language
English
Pages
216
Format
Hardcover
ISBN13
9781498745529
Categories

Through Silicon Vias: Materials, Models, Design, and Performance

Brajesh Kumar Kaushik (Author) · Manoj Kumar Majumder (Author) · Vobulapuram Ramesh Kumar (Author) · CRC Press · Hardcover

Through Silicon Vias: Materials, Models, Design, and Performance - Kaushik, Brajesh Kumar ; Ramesh Kumar, Vobulapuram ; Majumder, Manoj Kumar

New Book Imported to New Zealand
Delivery: 07 Jul - 14 Jul Shipping: 4 to 5 business days.
NZ$ 536.31
Import costs and 15% GST included in the price ✅
NZ$ 536.31

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Synopsis "Through Silicon Vias: Materials, Models, Design, and Performance"

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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