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portada Thermal Spreading and Contact Resistance: Fundamentals and Applications (Wiley-Asme Press Series)
Type
Physical Book
Language
English
Pages
468
Format
Hardcover
ISBN13
9781394187522
Edition No.
1

Thermal Spreading and Contact Resistance: Fundamentals and Applications (Wiley-Asme Press Series)

Yuri Muzychka; M. Michael Yovanovich (Author) · Wiley-Blackwell, · Hardcover

Thermal Spreading and Contact Resistance: Fundamentals and Applications (Wiley-Asme Press Series) - Yuri Muzychka; M. Michael Yovanovich

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Synopsis "Thermal Spreading and Contact Resistance: Fundamentals and Applications (Wiley-Asme Press Series) "

Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfacesProviding comprehensive coverage of the subject, Thermal Spreading and Contact Resistance is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.

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The book is written in English.
The binding of this edition is Hardcover.

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