Tracked shipping to New Zealand with premium packaging for just NZ$15 

Ship to
New Zealand
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada Semiconductor Packaging: Materials Interaction and Reliability
Type
Physical Book
Publisher
Author
Language
English
Pages
216
Format
Paperback
ISBN13
9781138075405
Edition No.
1

Semiconductor Packaging: Materials Interaction and Reliability

Andrea Chen Randy Hsiao-Yu Lo (Author) · Crc Press · Paperback

Semiconductor Packaging: Materials Interaction and Reliability - Andrea Chen Randy Hsiao-Yu Lo

Cheaper New Book Imported to New Zealand
Delivery: 04 Sep - 11 Sep Shipping: 13 to 14 business days.
NZ$ 266.32
Faster New Book Imported to New Zealand
Delivery: 21 Aug - 28 Aug Shipping: 4 to 5 business days.
NZ$ 306.98
Used BookGood Condition Imported to New Zealand
Delivery: 27 Aug - 09 Sep Shipping: 8 to 12 business days.
NZ$ 242.22
Import costs and 15% GST included in the price ✅
NZ$ 266.32

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "Semiconductor Packaging: Materials Interaction and Reliability"

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews